-> Titanium Basket
-> Iridium coated Titanium Plate
-> Mixed Metal Oxide Plate (MMO)
-> Titanium Bolt, Nut and Washer
-> Plating Jigs or Carriers
-> Ballast Media for barrel plating
-> Cu/Ni/ Sn - Anode Ball and Bars
-> Polypropylene Anode Bags
-> Titanium Metals (Grade 2,5 & 7)
-> Stainless Steel 321, 309, 310
-> Tungsten Steel
-> High Manganese Steel
-> Titanium Basket
-> Iridium coated Titanium Plate
-> Mixed Metal Oxide Plate (MMO)
-> Titanium Bolt, Nut and Washer
-> Plating Jigs or Carriers
-> Ballast Media for barrel plating
-> Cu/Ni/ Sn - Anode Ball and Bars
-> Polypropylene Anode Bags
-> Titanium Metals (Grade 2,5 & 7)
-> Stainless Steel 321, 309, 310
-> Stainless Steel 321, 309, 310
-> Stainless Steel 321, 309, 310
-> Stainless Steel 321, 309, 310
-> Tungsten Steel
-> High Manganese Steel
-> High Manganese Steel
-> RONACLEAN ™ US480 ALKALINE DEBUFFING solution is suitable for soak and ultrasonic cleaning metals.
-> It is suitable for copper-alloy, brass, nickel, silver and aluminium.
-> It is effective in removing the polishing wax and oxide film on the non-ferrous metal.
-> RONACLEAN ™ LP 200 is an acidic cleaner for Printed Wiring Board (PWB) Metallization application.
-> It works as removing remaining residues from developing aqueous, alkali strippable dry films.
-> Low foaming and ease for waste treatment process.
-> RONACLEAN ™ GP-300 LF is an alkaline soak or electrolytic cleaner.
-> Designed for primary cleaning of most metals with or without the use of organic solvent degreasing.
-> RONACLEAN ™ GP-300 LF is low foaming and is satisfactory as a simple immersion cleaner.
-> For better result, electrolytic process is recommended.
-> CUPURE ™ is a non-cyanide alkaline copper plating process
->It is easy to maintain and offers bright and ductile deposits with good throwing power.
-> It is suitable for steel as a stop – off for carbon-nitriding and as a pre-plate for nickel , acid copper or other finishes.
-> RONOVEL ™ CM and AUROSPEED ™ CM Cobalt – Alloyed Electrolytic Gold products utilize a unique chelate system.
->It able to prevents the oxidation of cobalt and substantially reduces the variation in cobalt co-deposition with respect to current density.
->It is designes for low – and high – speed plating applications.
->Suitable to use in all types of machines eg: reel-to-reel connector, stripe or strip-to-strip, automatic printed circuit tab, deep tank circuit and barrel plating.
->A highly-even thickness distribution across the plated parts are easily can achived.
-> COPPER GLEAM™ PPR-H is a process specifically designed for copper plating of printed circuit boards with Pulse Periodic Reverse current plating at specific horizontal equipments.
-> The combination of COPPER GLEAM PPR-H Acid Copper with suitable Pulse Periodic Reverse rectification offers dramatic improvement in deposit thickness distribution on the surface and in the hole without compromising productivity, or the need for low current density plating.
-> COPPER GLEAM PPR-H System is stable under the condition of use and produces deposits capable of meeting the requirements of Mil-P-551100-E and BS9760.
-> Improves throwing power and surface thickness distribution.
-> Produces even, semi-bright deposits from stable solution.
-> Increased productivity due to high current density capability in the horizontal mode.
-> Reduced soldermask and copper usage due to improved surface thickness distribution.
-> NICKELSTRIP ™ CF is a versatile nickel stipper.
->It removes electrolytically deposited nickel from steel and copper alloys by simple immersion without attacking the base metal.
-> It is no – cyanide based and suitable for steel and copper alloys.
-> Solder Strip 3880 is specifically formulated for the rapid removal of tin or tin-lead alloy on stainless steel belt in te semiconductor industry.
-> Solder Strip 3880 is a one – step process designes for using in M-to-M machines.
-> It produces low sludge , low fumes and no smell during operation.
-> It has superior holding capacity up to 200 g/L of dissolved solder.
->The SUPER STRIP 100 process will strip gold and gold alloys from all basis metal at unusually high speeds.
->There is little attack on base metals like iron, nickel, copper and their alloys.
-> Operate at room temperature and able to hold up 60 g/L of gold stripping.
-> Solder Strip SM is a non-peroxide , non-fluoride process designed for the fast stripping of tin (Sn) or tin-lead (SnPb) from copper and its alloys.
-> Its stripping rate is ca. 7 micron per minutes and can be increased to a high 20 micron per minutes under vigorous agitation and temperature.
-> Solder Strip SM does not attack copper or leave any residue / white smut.
-> It is able to dissolve 100 g/L of total SnPb before it is exhausted.
-> Solder Strip SM is an excellent choice for use in printed circuit boards eg: edge tab stripping prior to gold plating, especially in high – speed linear tab plating machines.
